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LPKF Builds Partner Network to Innovate Glass Substrate Production for Semiconductor Packaging
Using glass substrates for advanced packaging and heterogeneous integration represents a major shift in the current semiconductor market and one of the biggest challenges chip manufacturers face today. Read more
Sep 18, 2024
Faster Innovation and Agile Responses in Medical Applications with Micro 3D Printing
Exciting news from Nano Dimension Fabrica Group! Their M-810 polymer is set to transform the healthcare industry. Read more
Sep 16, 2024
More Cost-Effective and Improved: The new HEX150-125HL from Aerotech
More compact and more powerful than its predecessor Read more
Sep 13, 2024
STMicroelectronics Joins Quintauris as Sixth Shareholder
The semiconductor manufacturer is the latest organisation to join other industry players exploring the potential of RISC-V architecture Read more
Sep 11, 2024
Choose the Right System for You
Whether you're working on ground breaking research and development or pushing the boundaries of micro manufacturing, our Giga and Tera Series are here to support your endeavours. Read more
Sep 9, 2024
Succession Plan and New Leadership at Diener AG Precision Machining
After more than 40 years at the helm of Diener AG Precision Machining (DPM), Rolf Diener is stepping down from his role as CEO but will continue to contribute his expertise Read more
Sep 5, 2024
Greene Tweed Highlights Chemraz® 541 High-Strength, Universal-Purpose FFKM Black Compound for Semiconductor Applications
Greene Tweed, a leading global manufacturer of high-performance sealing solutions and engineered components, highlights Chemraz® 541, a universal-purpose, Read more
Sep 3, 2024
Boston Semi Equipment Launches New Test Site Module for Zeus Test Handler to Support Power IC Manufacturers
Boston Semi Equipment (BSE), a global leader in advanced automation solutions for the semiconductor and consumer electronics industries, introduces a new test site module for its Zeus gravity feed test handler to support high-voltage and partial dis Read more
Aug 29, 2024
Latest Articles
New Ruggedized Timing Technology Addresses the Challenges of GPS-Synchronized Defense Equipment
A new generation of oven-controlled oscillators (OCXOs) based on microelectromechanical systems (MEMS) technology is redefining precision timing technology for defense applications Read more
Sep 13, 2024
A Dicing Proposition: Driving Zero Defects in Today’s Intelligent Vehicles
To improve quality control and prevent the packaging of faulty chips in crucial electronic devices, the semiconductor sector is concentrating on automating the few remaining manual tasks in wafer processing. Read more
Sep 3, 2024
Comparing Semiconductor Test Socket Types Across ATE, Bench, and Validation Platforms
In the ever-evolving world of semiconductor manufacturing, ensuring that integrated circuits (ICs) meet stringent performance and reliability standards is crucial. Read more
Aug 22, 2024
How to meet the challenges for more Precise and Efficient Machining Monitoring
Interview with machining expert Dr. Buelent Tasdelen from Kistler Read more
Aug 13, 2024
Banking Electronic Chips for the Next Boom (or Bust)
Today, the parallels between the electronic chips that power just about every type of device today and the global oil market are undeniable, Read more
Aug 6, 2024
Productising Complex Silicon Chips Using Partial-Binning Techniques
The semiconductor industry continually pushes the boundaries of integrated circuit (IC) design and manufacturing. As chip complexity increases, so does the challenge of ensuring that each chip meets the stringent performance Read more
Jul 24, 2024
